Continuous Sputtering Coating System

Horizontal inline continuous sputtering coating system for high-throughput vacuum coating of plastic and industrial components.

Overview

This system is designed for continuous inline sputtering production under vacuum. It supports high-volume coating of carrier-loaded products with stable process timing, repeated fixture movement and controlled vacuum conditions.

Inline SputteringContinuous ProductionHigh ThroughputCarrier-Based Coating

Key Features

Inline Continuous Process

Horizontal continuous sputtering structure designed for stable production flow.

High Throughput

Designed for production capacity above 1,000 pieces per 9-hour shift for double-sided coated products.

Carrier-Based Handling

Manual loading and unloading of carriers with repeated fixture movement during coating.

Applications

Plastic ComponentsDecorative Metal FilmsIndustrial Surface FinishingCarrier-Based ProductsHigh-Volume Production

Technical Specifications

Equipment TypeHorizontal continuous sputtering vacuum coating system

ModelHN-LSD-0400-3C04

FootprintApprox. 5 m (L) × 5 m (W) × 1.5 m (H), main coating body

Carrier Takt Time< 900 s / carrier; actual cavity coating time approx. 720 s; chamber exchange time approx. 180 s after coating

Production Capacity> 1,000 pcs / 9-hour shift, double-sided coated products

Effective Coating Area300 mm (D) × 450 mm (L)

Maximum Substrate Size400 mm (D) × 600 mm (L) × 20 mm, aluminum carrier tray

Ceramic Body Size30 mm × 18 mm × 6 mm

Loading CapacityApprox. 56 pcs

Coating MethodHorizontal DC rotary magnetron sputtering

Loading MethodManual loading and unloading of components

Coating SequenceTwo coating steps, front and back side coating

Rotary Cathode Tube Size620 mm (L) × 100 mm (D)

Film Uniformity≤ ±4%, based on front-side film thickness uniformity; side coating uniformity not included

Fixture MovementCoating fixture tray speed adjustable with reciprocating movement during coating

Vacuum ConditionsInlet / outlet chamber ultimate pressure ≤ 1 × 10⁻¹ Pa; process chamber ultimate pressure ≤ 8 × 10⁻⁴ Pa

Substrate Carrier4 carriers; aluminum carrier tray

Need a customized coating solution?

System configuration, chamber size, target arrangement, pumping system and process modules can be adapted according to substrate geometry, film stack and production requirements.